ELECTROPLATING SYSTEMS FOR MICRO AND NANOTECHNOLOGY
Electroplating processes play a major role in micro and nanotechnology. Depending on the objective, we differentiate between electromechanical and electroless plating processes.
Process and boundary conditions are similar to those of wet process technology. In addition to these processes, current flow, electrical voltage and contacting are decisive. The aim of the electroplating processes is to carefully finish the products to the highest quality.
The systems are generally developed in close coordination with the user's requirements. Depending on the individual process, the systems are adapted for subsequent use. A directed flow can be a useful addition to the process, as can circulation, temperature control or filtration of the medium. Furthermore, the concentration of the electrolyte is a key parameter for the strength and homogeneity of the coating.
When developing substrate holders, we place particular emphasis on maximum coating surfaces. Single or multiple holders are developed with this in mind and according to customer requirements.
